View TLYH1050T20_3751844.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 1 toshiba led lamp tl(rmh,sh,oh,yh,gh,fgh)1050(t20) panel circuit indicator ? 5.2 (l) 5.2 (w) 4.0 (h) mm size ? tl h1050 (t20) series 3.6 mm transparent lens top type ? ingaa ? p leds ? high luminous intensity and low power consumption ? colors :red, orange, yellow, green ? clear luminescence is obtained ? high operating temperature: t opr ? 40 to 100c t stg ? 40 to 110c ? can be mounted using surface mounter. ? standard embossed taping 8 mm pitch : t20 (400 pcs/reel) ? reflow soldering is possible. ? applications: portable devices, backlighting, message signboards and amusement etc. color and material unit: mm jedec D jeita D toshiba 4-5au1 weight: 0.085g (typ.) product name color material tlrmh1050 red tlsh1050 red tloh1050 orange tlyh1050 yellow tlgh1050 green tlfgh1050 green ingaa ?p
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 2 absolute maximum ratings (ta = 25c) product name forward current i f (ma) reverse voltage v r (v) power dissipation p d (mw) operating temperature topr (c) storage temperature tstg (c) tlrmh1050 tlsh1050 tloh1050 tlyh1050 tlgh1050 tlfgh1050 50 4 120 ?40 to 100 ? 40 to 110 note: using continuously under heavy loads (e.g. the app lication of high temperatur e/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r product name min typ. max i f max v r tlrmh1050 1.7 2.0 2.5 tlsh1050 1.7 2.0 2.5 tloh1050 1.7 2.0 2.5 tlyh1050 1.7 2.1 2.5 tlgh1050 1.7 2.1 2.5 tlfgh1050 1.7 2.1 2.5 20 50 4 unit v ma a v ambient temperature ta ( c ) i f ? ta 0 80 60 0 100 80 120 40 20 40 20 60 allowable forward current i f (ma)
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 3 optical characteristics-1 (ta = 25c) luminous intensity i v product name min typ max i f corresponding brightness rank sign (note 2) tlrmh1050 272 700 2300 q/r/s tlsh1050 476 1400 4140 r/s/t tloh1050 476 1500 4140 r/s/t tlyh1050 476 1000 2300 r/s tlgh1050 272 600 1290 q/r tlfgh1050 85 250 736 20 n/p/q unit mcd ma note 2: the brightness rank classification ex ecutes based on the following rank table, and is classified by the reel. however, the delivery ratio of eac h classification is not defined. brightness rank rank sign min max n 85 230 p 153 414 q 272 736 r 476 1290 s 850 2300 t 1530 4140 unit mcd mcd optical characteristics-2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d product name min typ. max typ. min typ. max i f tlrmh1050 ? 636 ? 17 620 626 634 tlsh1050 ? 623 ? 17 607 613 621 tloh1050 ? 612 ? 15 599 605 613 tlyh1050 ? 590 ? 13 581 587 595 tlgh1050 ? 574 ? 11 565 571 576 tlfgh1050 ? 568 ? 11 559 565 571 20 unit nm nm nm ma caution z this led lamp emits some infrared light in addition to light in the visible spectrum. ensure that this ir light affects no photosensitive devi ce used near the led lamp. z this product is a product developed as a display source of light usage, and the me asurement standard matched to the sensitivity of person eyes is applied. therefore, use to functional usages (source of light for the sensor and the communication) other than the source of light for the display is not intended.
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 4 tlrmh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 10 100 1000 10000 1 10 100 ta = 25c 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 i v ? i f i v ? tc 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c 0.1 ?40 1 10 ? 20 0 20 40 60 80 100 3 5 0.3 0.5 ta = 25c ta = 25c i f ? v f forward voltage v f (v) forward current i f (ma) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity relative luminous intensity ? wavelength radiation pattern luminous intensity i v (mcd)
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 5 tlsh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 100 1000 10000 1 10 100 i v ? tc i f ? v f i v ? i f 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 ta = 25c ta = 25c forward voltage v f (v) forward current i f (ma) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity ? wavelength luminous intensity i v (mcd) relative luminous intensity ta = 25c radiation pattern
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 6 tloh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 100 1000 10000 1 10 100 i v ? tc i f ? v f i v ? i f 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 ta = 25c ta = 25c forward voltage v f (v) forward current i f (ma) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity ? wavelength luminous intensity i v (mcd) relative luminous intensity ta = 25c radiation pattern
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 7 tlyh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 10 100 1000 10000 11 0 100 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 i v ? tc i f ? v f 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 ta = 25c ta = 25c forward voltage v f (v) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity ? wavelength luminous intensity i v (mcd) relative luminous intensity ta = 25c radiation pattern forward current i f (ma) i v ? i f
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 8 tlgh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 100 1000 10000 1 10 100 i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 i f = 20 ma ta = 25c 0 0.4 1.0 0.8 540 0.6 0.2 620 600 580 560 i f ? v f i v ? i f ta = 25c ta = 25c forward voltage v f (v) forward current i f (ma) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity ? wavelength luminous intensity i v (mcd) relative luminous intensity ta = 25c radiation pattern
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 9 tlfgh1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 1 10 100 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 1 10 100 1000 1 10 100 i v ? tc i f ? v f i f = 20 ma ta = 25c 0 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 ta = 25c ta = 25c forward voltage v f (v) forward current i f (ma) relative luminous intensity i v case temperature tc (c) wavelength (nm) relative luminous intensity ? wavelength luminous intensity i v (mcd) relative luminous intensity ta = 25c radiation pattern i v ? i f forward current i f (ma)
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 10 packaging these led devices are packed in an aluminum envelope with silica gel an d a moisture indicator to prevent moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture-proof bag may be stored unopened for up to 12 months under the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an environment of 5c to 30c/70% rh or below. 3. if, upon opening, the moisture indicator card show s humidity of 30% or above (when the indication color changes to pink) or the expiration da te has passed, the devices should be baked while packed in the tape reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. repeated baking may cause the pee ling strength of the tape to change, leading to trouble in mounting. also, be sure to prevent damage to the device from static electricity during the baking process. 5. any breakage in the laminate pack ing material will cause the hermetically of the product to deteriorate. do not toss or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the product is evaluated using above re flow soldering conditions. no addition al test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? perform the first reflow soldering in accordance with the above temperature prof ile and within 72 hours of opening the package. ? second time reflow in case of second reflow soldering should be perfor med within 72 hours of the first reflow under the above conditions. storage conditions before the second reflow soldering: 5 30 c, 70% rh max ? do not perform flow soldering and soldering dip. ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron: less than 25 w temperature : less than 350 c or less time : within 3 s (up to once per place) 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile for pb soldering (example) time (s) package surface temperature ( c) temperature profile for pb-free soldering (example) 150~180 c 4 c/s max 5 s max 260 c max 4 c/s max 230 c 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30~50s max (*) max (*)
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 11 recommended soldering pattern cleaning when cleaning is required after soldering, tosh iba recommends the following cleaning solvents. our dipping tests (carried out under the recommended conditio ns) confirm that these solvents have no effect on semiconductor devices. in selecting the cleaning solvent you will actually use, be su re to take into account the cleaning conditions and usage conditions. cleaning solvent manufacturer asahi clean ak-225aes asahi glass kao clean through 750h kao pine alpha st-100s arakawa chemical precautions when mounting do not apply force to plastic parts of th e led under high-temperature conditions. the led plastic is easily scratched. avoid friction between plastic parts and hard objects or materials. when installing the pcb in a product, ensure that the device does not come into contact with other components. this product doesn't apply mounting that solder flow. please mount on recommended reflow solder mounting condition. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, howeve r, does not apply to products whose electrical characteristics differ from standard toshiba specifications.) (1) tape type: t20 (8-mm pitch) (2) example tape type 2. handling precautions tape material protected against static electricity. howeve r, static electricity may occur depending on quantity of charged static electricity and a device may atta ch to a tape, or a device may be unstable when peeling a tape cover. (a) in process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. (b) for transport and temporary storage of dev ices, use containers(boxes, jigs, and bags) that are made of anti-static materials or of ma terials that dissipate electrostatic electricity. 2.45 1.3 2.7 unit: mm 2.45 tlrmh1050 (t20) toshiba product no.
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 12 3. tape dimensions (unit: mm) symbol dimension toleranc e symbol dimension tolerance d 1.5 +0.1/?0 p 2 2.0 0.05 e 1.75 0.1 w 12.0 0.2 p 0 4.0 0.1 p 8.0 0.1 t 0.4 0.05 a 0 5.5 0.1 f 5.5 0.05 b 0 5.5 0.1 d 1 1.6 0.1 k 0 4.4 0.1 a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 13 4. reel dimensions unit: mm 5. leader and trailer section of tape note-1 : empty trailer section note-2 : empty leader section 13 0.3 180 +0 ?4 60 13 15.4 1.0 2 0.5 44 40mm or more (note-1) 40mm or more (note-2) leading part 190 mm (min)
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 14 6. packing form (1) packing quantity reel 400 pcs carton 2,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 7. label format 1 example tlrmh1050(t20) p/n: toshiba type tlrmh1050 addc (t20) q?ty 400 pcs lot number key code for tsb 32c 400 (rank symbol) use under 5-30degc/70%rh within 168h sealed [[g]]/rohs compatible diffused in ***** *y380xxxxxxxxxxxxxxxxxx* assembled in ***** 2 label location *the lot number includes the following information. example: 270 7 b 3 b ?packaged february 22, 2007? a b c d e a: domestic id b: last digit of the year (ce): ?0? (y2000), ?1? (y2001), ?2? (y2002) ~ ?9? (y2009) repeated for each decade c: month: ?a? (jan), ?b? (feb), ?c? (mar) ~ ?l? (dec) d: decade of the month: ?1? (first), ?2? (middle), ?3? (last) e: day in d above: ?a? (1st), ?b? (2nd), ?c? (3rd) ~ ?j? (9th), ?k? (10th) ?l? denotes the 31st of the month ?i? is not used to denote a day in this date system tape reel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.
tl(rmh,sh,oh,yh,gh,fgh)1050(t20) 2009-07-30 15 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

▲Up To Search▲

Price & Availability of TLYH1050T20

	To Download TLYH1050T20 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .